The evolution of the spatial structure of global integrated circuit trade network and its relational upgrading

LI Tingzhu, DU Debin, HUANG Xiaodong

GEOGRAPHICAL RESEARCH ›› 2023, Vol. 42 ›› Issue (3) : 597-616.

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GEOGRAPHICAL RESEARCH ›› 2023, Vol. 42 ›› Issue (3) : 597-616. DOI: 10.11821/dlyj020220527

The evolution of the spatial structure of global integrated circuit trade network and its relational upgrading

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2023, 42(3): 597-616 https://doi.org/10.11821/dlyj020220527

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